| Name | Year Awarded | Related Articles |
| Wei Che | 2002 | A Study on the Material Detachment Mechanisms in CMP Process. |
| Antonia Antoniou | 2003 | Experimental crack tip characterization for closed cell aluminum foam |
| Chunyu Yang | 2003 | Measurements of interface thickness of two dissimilar materials : numerical and experimental verification |
| Sunil D. Gouda | 2004 | – |
| Sivaraman Kadavasal (Kumar) | 2005 | Yield improvement in chemical mechanical planarization via material removal variation on a surface |
Jiayi Wu (Ivy)
| 2005 | – |
| Deify Law | 2005 | Analytical and experimental analysis of long wavelength waviness generated by wire lateral deflection on the wire-sawn ductile material surface for semiconductor application |
| Shakti Singh Chauhan | 2005 | A new tensile testing methodology for stable mechanical characterization of free-standing films |
| Xiaoping Wang | 2006 | Multi-scale models for wafer surface evolution in chemical mechanical planarization |
| Chia-Yung Chao | 2007 | – |
| Khiam-How Low | 2008 | Characterization of conductive surface printing via electric field induced ion transport |
| Mohamed Allam | 2008 | – |
| Dibyadeep Paul | 2010 and 2011 | Focussed electric field induced ion transport: A novel nano-patterning process |
| David Asplund | 2011 | Chemical Mechanical Paired Grinding |
| Ben Burke | 2011 | – |
| William Lai | 2011 | Characteristics of dielectric elastomers and fabrication of dielectric elastomer actuators for artificial muscle applications |
| Cheng Deng | 2011 | – |
| Zihou Zhang | 2013 | Experimental study of ultra-thin films mechanical integrity by combined nano-indentation and nano-acoustic emission |
| Kaustubh Kulkarni | 2021 | – |